Chilas: a laser-focused role in the FLEXIT project
The Chilas laser is one of the simplest hybrid photonic devices around, consisting of only two photonic integrated chips (PICs). Together, these offer unique characteristics: a wavelength agility with ultra-narrow linewidths of below 1 kHz, providing a very pure colour for a wide range of high-tech applications. Within the FLEXIT project, Chilas aims to adapt these two chips for compatibility with flip-chip assembly methods that rely on passive placing accuracies of ~1 µm for the scalable production of hybrid photonic devices.
On a technical level, Chilas develops and supplies high-end semiconductor external cavity tunable lasers with ultra-narrow linewidths, which can be tuned over the C-band to cover a wavelength range larger than 100 nm with a linewidth of less than 1 kHz, as well as high output power and low noise. This laser is temperature-stabilised and comes in a 14-pin butterfly package. The external cavity laser (ECL) is constructed via hybrid integration of both an indium phosphide (InP) gain section and a silicon nitride (Si3N4) wavelength selective feedback PIC. The InP gain section provides the high-power output (>30 mW with 100 mW under development) over a wide wavelength range, whereas the Si3N4 PIC provides the low loss configurable feedback to the gain section.
The FLEXIT project is funded by:
