In the NXTGEN Hightech programme, work is being done within the Semiconductors domain on the next generation of chips. This effort is spread across nine projects. In this webinar, you will receive an update on the developments to date in the NXTGEN Hightech projects Semicon 03 & Semicon 05:

Semicon 03 NXTGEN Chip Assembly Equipment (ITEC)
Semicon 05 Deposition and Printing for Heterogeneous assembly (TNO-Holst)

• ‘Future chip assembly equipment and applications’ by ITEC
• ‘Deposition and Printing for Heterogeneous assembly ‘ by TNO-Holst

Who Should Attend?

This webinar is designed for professionals in the fields of Semiconductors, who are curious about the developments in the NXTGEN Hightech Semicon project.

Agenda

• Welcome
• Future chip assembly equipment and applications by ITEC. Market drivers and technology trends. ITEC assembly equipment roadmap – new system architectures
• Deposition and Printing for Heterogeneous assembly by TNO-Holst. Processes for high-volume and high-speed chip assembly. 3D printed electronics, additive manufacturing of electronics systems, process and equipment.
• Q&A
  If you already have questions upfront, please send them to semiconductors@hightechnl.nl, and we will try to answer them during the webinar or at a later stage.

More about the Semicon 03 project:
The NXTGEN Chip Assembly Equipment project focuses on developing advanced technologies and process flows for the next generation of chip assembly equipment, which needs to be more efficient, precise, and cost-effective. In the Netherlands, traditionally strong in the production and assembly of semiconductors, there is an urgent need for innovation to meet growing market demand and address shortcomings of current systems, such as limited productivity and high energy consumption. This project aims for a paradigm shift by integrating contactless handling with precisely controlled force fields, enabling an energy-efficient and fully digitally controllable chip assembly.