On Thursday, May 9, we will organize our next BCSEMI NL Membership meeting at Nexperia in Nijmegen. Please register and join us in Nijmegen!

• Date: Thursday, May 9 (14.00-17.30u)

• Location: Nexperia, Nijmegen

• Theme: “The future in packaging”

• Program:

14:00 Walk in
14:30  Welcome by Charles Smit
14:35  BCSEMI NL update by Barry Peet
14:45  Presentation “Challenges in Semiconductor Packaging”
by Rene Poelma, Senior Principal Engineer, Nexperia
15:15   Presentation “High Precision Assembly & Packaging”
by Biba Visnjicki, Director Business Development, Fraunhofer
15:45  Presentation “Vision and directions in High Volume chip assembly equipment” 
by Joep Stokkermans, Innovation Manager, Nexperia
16:15  Guided Tour ITEC (Nexperia)
17:00 Networking Drinks

Join us in Nijmegen on May 9! Please register via the button on the right. We warmly welcome you at Nexperia.