Driving the success of European semiconductors

Heterogeneous system integration, packaging and reliability play a crucial role for the current and future development of semiconductors, quantum technologies and photonics. They are the key enabler to create new functionalities and business opportunities through the integration of different types of cost-effective and high-performance chips, technologies and materials into a single system. This seminar will discuss the progress and future challenges of heterogeneous integration, packaging, reliability and the potentials of creating more industry and business value. Join us to explore the exciting opportunities that heterogeneous system integration can offer for the European ecosystem.

Event on Thursday, April 10th 2025, TU Delft.
Online registration deadline: April 3rd, 2025.
Location: EEMCS-Lecture Hall Chip, 36.HB.01.600, TU Delft, Netherlands

Contact

Due to limited seats, cost-free registration is required, by contacting secr-ectm-ewi@tudelft.nl.
More information: Seminar_IEEE_EPS_2025