3D Integration of Micro Components | HTSM roadmap semiconductor equipment
3D Integration of Micro Components
This event focuses on 3D integration of micro components from an industry, user and machine maker’s perspective.
What opportunities does this entail for Small and Medium Enterprises?
Learn about the directions, applications and challenges and discuss with other participants.
The event is moderated by Patrick de Jager, Senior Research Director at ASML.
You are welcome from 12.30 h. The programme starts at 13.00 h.
Programme overview
APPLICATION DOMAINS | ||
13.00 | Heterogeneous integration at NXP >>read more |
Jan Gülpen Back End Innovation at NXP |
Application and Integration of (CMUT) Ultrasound >>read more |
Johan Klootwijk Team Lead at Philips Research |
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Unfolding Fashion Tech: micro components in garments >>read more |
Marina Toeters Fashion tech designer @by-wire.net, co-owner of the Fashion Tech Farm |
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Semiconductor trends in lighting industry >>read more |
Patrick van den Heuvel R&D Manager at Signify |
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Assembly of a Frequency Modulated Continuous Wave LIDAR system >>read more |
Peter Harmsma Scientist at TNO |
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14.15 | Break | |
MACHINE, TECHNOLOGY PERSPECTIVE AND METROLOGY DOMAINS | ||
14.30 | Backend lithography challenges for more than Moore devices >>read more |
Jeroen de Boeij System architect at Kulicke & Soffa |
How laser is enabling the semiconductor roadmap >>read more |
Jeroen van Borkulo Head of Business & Marketing at ASM Laser Separation International |
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The use of integrated photonics for precision sensing >>read more |
Pim Kat Chief Executive Officer at Amazec Photonics |
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Perspectives on emerging and disruptive technologies for microelectronics >>read more |
Marcel Grooten Managing Director at DoMicro |
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Flux-less Thermocompression Bonding of Large Area Dies with High Density Interconnects Via In-Situ Oxide Reduction >>read more |
Andreas Marte Senior Principal Engineer at Kulicke & Soffa |
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15.45 | Break | |
16.00 | Breakout sessions | |
16.30 | Wrap-up | |
17.00 | Networking drinks | |
Practical details
Date:
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Thursday, 15 September 2022 |
Time:
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Check-in: 12.30h Programme: 13.00-17.30h |
Location:
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Igluu Eindhoven Lichttoren 32 5611 BJ Eindhoven Google Maps |
This event is an initiative of the HTSM Roadmap Semiconductor Equipment team, in cooperation with High Tech NL/Holland Semiconductors.
Powered by a Holland High Tech MIT-Network activities (MIT-regeling-NetwerkActiviteiten) grant.